Chemical dipping equipment is developed to weaken mouldflahes on the leadframe leads and heatsink of the microchips without damaging the package mould compound.
After chemical dipping remaining mould flashes can be easily removed by high pressure waterjet .
The chemical dipping lines are fully automated batch loading lines.
* Temperature control up to 120 degree
* Temperature and dipping time monitoring system
* Auto chemical dosing system
* Water rinsing units